面向Micro-LED封装的先进半导体键合集成技术Advanced Semiconductor Bonding Technology for Micro-LED Integration母凤文北京青禾晶元半导体科技有限责任公司董事长兼总经理MU FengwenPresident and General Manager of Innovative Semiconductor Substrate Technology co., Ltd.
基于混合键合的无损Micro-LED芯片技术Damage-free Micro-LED Based on Hybrid Bonding Technology 蒋振宇苏州秋水半导体科技有限公司董事长JIANG ZhenyuPresidentof Suzhou QiuShui Semiconductor Technology Inc.
全色域光源在光疗愈中的应用探索Application of Fullgamut LED Source in Phototherapy王孟源佛山市中昊光电科技有限公司董事长、总经理WANG MengyuanPresidentGeneral Manager of Foshan EVERCORE Optoelectronic Technology Co., LTD
高质量磷化铟和锑化镓衬底制备技术进展及批量生产Progress in Preparation Technology and Batch Production of High Quality InP and GaSb Substrates赵有文珠海鼎泰芯源晶体有限公司董事长ZHAO YouwenChairman of Zhuhai DT Wafer-Tech Co.,lTD
Light-extraction efficiency and performance of transparent ultraviolet C-band light-emitting diodes张剑平美国Bolb Inc.董事长兼首席技术官ZHANG JianpingChair of the BoardCTO of Bolb Inc., USA
应用于新冠杀菌的毫秒级脉冲新型驱动电源New Millisecond-level Pulse Drive Power Applied to the Sterilization of COVID-19吴光敏--深圳市易光科技有限公司董事长WU Guangmin--Chairman of YG Power Supply Co.,ltd
