中科院微电子所副研究高可靠功率系统集成的发展和挑战Development and Challenge of High-Reliability Power System in Packaging侯峰泽中国科学院微电子研究所系统封装与集成研发中心副研究员Fengze HOUAssociate Professor、 Packaging and Integration Research and Development Center, Institute of Microelectronics of Chinese Academy of Sciences
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