电流/功率截止频率为135/310 GHz的高性能硅基InAlN/GaN HEMTsHigh-Performance InAlN/GaN HEMTs on Silicon Substrate with fT/fmax of 135/310 GHz 崔鹏山东大学新一代半导体材料研究院研究员CUIPengResearch Fellow of the Institute of Novel Semiconductor of Shandong University

氮化镓推动5G、射频能源及其他领域的创新GaN Driving innovation in 5G, RF Energy and beyond裴轶苏州能讯高能半导体有限公司副总裁PEI YiVice President of Dynax Semiconductor, Inc

AECQ-101车规级认证的高性能1200V SiC MOS器件史文华清纯半导体研发经理SHI Wenhua RD Manager of SiCHAIN Co.,Ltd.

SiC MOS在新能源汽车充电桩中的技术进展及应用田亮南瑞联研半导体有限责任公司碳化硅产品线负责人TIAN Liang Leader of SiC Product for NARI-GEIRI semiconductor co.Ltd

功率半导体国产银烧结整体解决方案Power semiconductor domestic silver sintering overall solution吴昊深圳市先进连接科技有限公司总经理WU Hao General Manager of Shenzhen Advancde Joining Technology Co.,Ltd.

全色显示材料与3D芯片集成技术Integrated technology of panchromatic display materials and 3D chips范谦东南大学下一代半导体材料研究所研究员

基于光响应聚合物的Micro-LED可编程巨量组装技术研究进展Research Progress of the Micro-LED Programmable Massive Assembly Technology Based on Photoresponsive Polymers龚政广东省科学院半导体研究所教授，新型显示团队负责人Gong ZhengProfessor of the Institute of Semiconductors, Guangdong Academy of Sciences, Head of the Frontier Display Technology Team

等离子刻蚀技术在第三代化合物半导体领域的应用Application of Plasma Etching Technology in the Third-generation Compound Semiconductor Field谢秋实北京北方华创微电子装备有限公司 第一刻蚀事业部副总经理XIE QiushiDeputy General Manager of NAURA Technology Group Co., Ltd.

GaN半导体垂直腔面激光器的仿真设计与分析Simulation Design and Analysis of GaN Semiconductor Vertical Cavity Surface Laser张紫辉河北工业大学教授ZHANG ZihuiProfessor of Hebei University of Technology

激光雷达用的1550nm磷化铟半导体激光器1550 nm InP semiconductor laser for lidar黄永光河南仕佳光子科技股份有限公司有源产品技术总监,中科院半导体所研究员HUANG YongguangTechnical Director of Henan Shijia Photons Technology Co., Ltd., Professor of Institute of Semiconductors, Chinese Academy of Sciences

基于蓝光半导体激光器的新器件：SWOT分析New devices based on blue laser diodes: SWOT analysis.Mike LESZCZYNSKI波兰高压物理研究所研究员Mike LESZCZYNSKIProfessor of Institute of High Pressure Physics, Poland

超宽禁带半导体氧化镓及金刚石的晶体生长模拟研究Modeling of ultrawide Bandgap Semiconductor crystal growth for Gallium oxide and Diamond付昊苏州思体尔软件科技有限公司副总经理Henry FUVice General Manager of SuZhou STR Software Technology Co., Ltd.

超宽禁带六方氮化硼二维原子晶体及其光电器件Growth of ultra-wide band-gap two-dimensional hexagonal boron nitride for optoelectronic devices张兴旺中国科学院半导体所研究员ZHANG XingwangProfessor of Institute of Semiconductors, Chinese Academy of Sciences

新型宽禁带压电半导体材料-Ga2O3及其在射频谐振器中的应用-Ga2O3: an Emerging Wide Bandgap Piezoelectric Semiconductor for Application in Radio Frequency Resonators王钢中山大学佛山研究院院长，中山大学半导体照明材料及器件国家地方联合工程实验室主任、教授WANG GangProfessor and Dean of Foshan Institute of Sun Yat-Sen University; Director of the National-Local Joint Engineering Laboratory of Semiconductor

第三代半导体技术MicroLED光电显示世界周佳利晶微电子技术（江苏）有限公司 总经理助理/Micro LED研究院副院长ZHOU JiaLEADSTAR Micro-Crystal Display Corporation(JiangSu)Ltd.

用于Micro LED芯片规模量产化的化学剥离生长衬底技术Chemical Peel Growth Substrate Technology for Mass Production of Micro LED Chips郝茂盛上海芯元基半导体科技有限公司总经理HAO MaoshengGeneral Manager of Shanghai Chipfoundation Semiconductor Technology Co., Ltd.

全球产业链顶级智囊汇聚苏州 共议第三代半导体产业新风向第八届国际第三代半导体论坛暨第十九届中国国际半导体照明论坛在苏州盛大召开2月8日，第八届国际第三代半导体论坛（IFWS）第十九届中国国际半导体照明论坛（SSLCHINA）在苏州盛大开幕。在这场被视为全球第三代半导体行业风向标的盛会上，大会主席、全国政协教科卫体委员会副主任、科技部原副部长曹健林，中国科学院院士、浙江大学教授杨德仁，中国科学院院士、南昌大学副校

宽禁带半导体助推电动汽车进程Wide Bandgap Devices Empower Vehicle Electrification李道会--蔚来汽车功率半导体设计团队负责人、高级总监

用于先进SiC功率模块的整体解决（核心设备/材料/工程）方案Overall solution (core equipment/materials/engineering) for advanced SiC power module周鑫苏州博湃半导体技术有限公司市场销售总监ZHOU XinDirector of Sales Marketing, Suzhou Bopai Semiconductor Technology Co., Ltd.

第三代半导体助力数字能源产业发展The wide bandgap semiconductor boosts the development of digital energy industry于坤山北京世纪金光半导体有限公司副总裁YU KunshanVice President of CENGOL