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高功率宽禁带半导体射频器件研究进展Research Progress of High Power Wide Band-gap Semiconductor RF Devices张进成西安电子科技大学副校长、教授ZHANG JinchengVice PresidentProfessor of Xidian University

实现超小型全氮化微型LED的纳米级材料科学Nanometer-scale Materials Science Enabling Ultra-small All-Nitride Micro-LEDsLarsSAMUELSON瑞典皇家科学院及工程院两院院士、中国科学院外籍院士、瑞典德隆大学教授、南方科技大学讲席教授LarsSamuelsonMember of Royal Swedish Academy of Engineering, Member of Royal Swedish Academy of Sciences，Foreign Member of the Chinese Academy of Sciences, Professor of Lund Univer

融通半导体产业链 构建应用创新生态圈Integrate Semiconductor Industry Chain to Build Application Innovation Ecosystem李虹华润微电子有限公司总裁LI HongPresident of China Resources Microelectronics Limited

最新高性能SiC MOSFET技术助力未来SiC市场的发展趋势The Latest High Performance SiC MOSFET Technology Trend for Future SiC Market Development濱田公守日本华为股份有限公司高级首席专家Kimimori HAMADASenior Chief Expert Huawei Technologies Japan

基于大失配外延的氮化物第三代半导体材料与器件Nitride Semiconductor Materials and Devices Based on Large Mismatch Epitaxy沈波北京大学理学部副主任、特聘教授SHEN Bo Deputy Deanand Distinguished Professorof Facultyof Science, Peking University

用于病毒灭活的蓝宝石生长230nm远紫外光功率模组的开发研究Development of 230 nm Far-UVC LED Power Module Grown on c-Sapphire for Human Harmless Virus Inactivation平山秀樹日本理化研究所平山量子光素子研究室主任Hideki HIRAYAMAProfessor ofRIkagaku KENkyusho Institute of Physical and Chemical Research(RIKEN),Japan

加快碳化硅芯片和电力电子器件的商业化发展Accelerating Commercialization of SiC Chips and Power ElectronicsVictor VELIADIS美国PowerAmerica执行董事兼CTO、ICSCRM 2024 大会主席、北卡罗莱纳州立大学教授、IEEE宽禁带功率半导体技术路线图委员会(ITRW)主席Victor VELIADISExecutiveDirector and CTO of PowerAmerica, Chair of ICSCRM 2024, Professor of North Carolina State Universityand Chair of ITRW ( IEEE Wide Ban

2024中国第三代半导体技术十大进展/ 2024 China's Top 10 Advances in Wide Band-gap Semiconductor Technology

半导体材料产业的现状和挑战Status and Challenge of Semiconductor Material Industry杨德仁中国科学院院士、浙大宁波理工学院校长、浙江大学硅及先进半导体材料全国重点实验室主任、教授YANG DerenAcademician of Chinese Academy of Sciences,President of NingboTech University, Professor and Director of State Key Laboratory of Silicon and Advanced Semiconductor Materials, Zhejiang University

基于量子点光刻技术的 0.18cc全彩Micro-LED光机0.18cc Full-color Micro-LED Light Engine Powered by QDPR Technology庄永漳镭昱光电科技(苏州)有限公司创始人兼CEOEddie CHONGFounderCEO of Raysolve Optoelectronics (Suzhou) Company Limited.

从芯到屏，垂直整合开启Micro-LED智慧显示时代From Chip to Screen, Vertical Integration - Open the Era of Micro-LED Smart Display席光义元旭半导体科技股份有限公司董事会主席兼CEOXI GuangyiChairman and CEO of Novoshine

面向Micro-LED封装的先进半导体键合集成技术Advanced Semiconductor Bonding Technology for Micro-LED Integration母凤文北京青禾晶元半导体科技有限责任公司董事长兼总经理MU FengwenPresident and General Manager of Innovative Semiconductor Substrate Technology co., Ltd.

台湾錼创科技副总经理吕志强：MicroLED的量產策略

基于纳米压印全生态产业平台的微纳光学器件制造Manufacturing of Micro and Nano Optical Devices Based on Nanoimprint Eco-industrial Platform罗刚材料科学姑苏实验室研究员、苏州新维度微纳科技有限公司创始人LUO GangProfessor of Gusu Lab, Founderof NDnano

CSP芯片级封装在Mini-LED背光中的应用进展The Progress of Chip Scale Package in Mini-LED TV Backlighting刘国旭北京易美新创科技有限公司CTO、执行副总裁Jay Guoxu LIUCTOExecutive VP of ShineOn Innovation Technology Co., Ltd