基于混合键合的无损Micro-LED芯片技术Damage-free Micro-LED Based on Hybrid Bonding Technology 蒋振宇苏州秋水半导体科技有限公司董事长JIANG ZhenyuPresidentof Suzhou QiuShui Semiconductor Technology Inc.
显示用Micro-LED芯片与集成技术新进展New Progress of Micro-LED Chip and Integration Technology for Display黄凯厦门大学物理科学与技术学院副院长、教授HUANG KaiDeputy DeanProfessor of College of Physical Science and Technology, Xiamen University
集成反射器的封装技术用于提升高功率UVC LED芯片的光提取效率Enhanced Light Extraction Efficiency of high power UVC LEDs by SMD-Packaging with Integrated Reflectors胡晓东德国MSG Lithoglas GmbH亚太地区总监HU XiaodongDirector of Asia Pacific Region of MSG Lithoglas GmbH, Germany
用于Micro LED芯片规模量产化的化学剥离生长衬底技术Chemical Peel Growth Substrate Technology for Mass Production of Micro LED Chips郝茂盛上海芯元基半导体科技有限公司总经理HAO MaoshengGeneral Manager of Shanghai Chipfoundation Semiconductor Technology Co., Ltd.