玻璃基TFT Micro-LED拼接屏的机遇和挑战Opportunities and Challenges of TFT Micro-LED Display曹轩成都辰显光电有限公司副总经理Carl CAOVice General ManagerCTO of Chengdu Vistar Optoelectronics Co., Ltd.
耐高能量密度照明及健康照明封装发展机遇及挑战Development opportunities and challenges of high energy density lighting and health lighting packaging陈磊旭宇光电(深圳)股份有限公司研发总监、清华大学博士后CHEN LeiRD Director of XUYU OPTOELECTRonICS(SHENZHEN) CO., LTD.
背光模组中Mini LED对封装材料的要求与挑战Requirements and Challenges for Packaging Materials for Mini LEDs used in Backlight Modules徐建军北京康美特科技股份有限公司首席技术官Jianjun XUCTO of Beijing KMT Technology Co., Ltd.