Adding efficiency to electronics with III-Nitride technologySrabanti CHOWDHURY美国斯坦福大学电气工程副教授Srabanti CHOWDHURYAssociate Professor of Electrical Engineering and Senior Fellow at the Precourt Institute for Energy, USA

基于P区反序掺杂策略的高效碳化硅结势垒肖特基二极管的研究High-Performance 1200 V/ 20 A 4H-SiC JBS Diodes with Retrograde P-Implants Strategy张园览复旦大学Yuan-Lan ZHANGFudan University

高可靠功率系统集成的发展和挑战Development and Challenge of High-Reliability Power System in Packaging侯峰泽中国科学院微电子研究所系统封装与集成研发中心副研究员Fengze HOUAssociate Professor、 Packaging and Integration Research and Development Center, Institute of Microelectronics of Chinese Academy of Sciences

先进封装大板扇出研发及功率器件封装应用The Research on Panel Level Fan Out Package and its Application on Power Electronics林挺宇广东佛智芯微电子技术研究有限公司副总经理，广东省半导体智能装备与系统集成创新中心首席科学家Tingyu LINDeputy General Manager of Guangdong FZX Microelectronics Technology Co. Ltd, Principal Scientist of CNC Equipment Cooperative Innovation Institute

促进宽禁带半导体产业化的关键外延技术The key epitaxial technology to promote the industrialization of wide bandgap semiconductors方子文德国爱思强股份有限公司中国区副总经理FANG ZiwenDeputy General Manage，China AIXTRON SE

第三代半导体碳化硅器件产业化关键技术及发展进展The key technology and development progress of the Wide Band-gap semiconductor silicon carbide device industrialization钮应喜芜湖启迪半导体有限公司研发总监NIU YingxiRD Director of Wuhu Advanced Semiconductor Manufacturing Co.,ltd

SiC 功率MOSFET器件的可靠性研究Development trends and challenges of SiC Power MOSFET device 张艺蒙西安电子科技大学微电子学院教授Yimeng Zhang Professor of School of Microelectronics, Xidian University

化合物半导体工艺设备解决方案 Equipment and Processes Solutions in Compound Semiconductor王显刚北京北方华创微电子装备有限公司LED及化合物半导体行业发展部总经理WANGXiangangGeneral Manager ofLED and Compound Semiconductor Developmentdepartment, Beijing NAURA Microelectronics Equipment Co.,ltd.

SiC MOS器件氧化后退火新途径低温再氧化退火技术A new approach of post-oxidation annealing for SiC MOS devices -- the low-temperature re-oxidation annealing technology王德君大连理工大学教授Wang DejunProfessor of Dalian University of Technology

SiC功率器件制造工艺特点与核心装备创新进展Manufacturing process characteristics and key equipment development of SiC power devices巩小亮中国电子科技集团公司第四十八研究所 半导体装备研究部副主任GONGXiaoliang Deputy director of Semiconductor equipment research department, the 48th Research Institute of China Electronics Technology Group Corporation

碳化硅芯片会在 2025-2030 年被电动汽车广泛采用的可能性探讨The Question: Will SiC chips be widely adopted by Electric Vehicles in 2025-2030?Anant AGARWAL美国俄亥俄州立大学教授、IEEE会士Anant AGARWALProfessorofThe Ohio State University, IEEE Fellow

SiC器件在新能源汽车产业中的应用Application of SiC devices in the new energy automobile industry吴壬华深圳欣锐科技股份有限公司董事长WURenhuaChairofthe Board, SHINRY

SiC器件和模块的最新进展RecentAdvancesofSiCPowerDevices张清纯复旦大学特聘教授、上海碳化硅功率器件工程技术研究中心主任Jon Zhang--Distinguished Professor of Fudan University

碳化硅大规模商业化：现状与障碍SiC Mass Commercialization: Present Status and BarriersVictor VELIADISChief Officer and CTO ofPower America, Professor of North Carolina State UniversityVictor VELIADIS美国电力首席执行官兼首席技术官、北卡罗莱纳州立大学教授

用于极端环境电子产品的 SiC 集成电路SiC Integrated Circuit for Extreme Environment ElectronicsCarl-Mikael Zetterling--瑞典皇家理工学院教授Carl-Mikael Zetterling--Professor of Royal Institute of Technology (KTH), Sweden

Ⅲ族氮化物半导体光电子器件的几个科学问题张荣--厦门大学校长、教授

新型电力系统与国家双碳战略New Power System and NationalDual-Carbon Strategy汤广福--中国工程院院士、全球能源互联网研究院院长TANG Guangfu--Academician of Chinese Academy of Engineering, President of Global Energy Interconnection Research Institute

宽禁带半导体，助力推动绿色出行和碳中和WBG, Way to Boost Green Mobility and Carbon NeutralityGeorges Andary--博世苏州汽车部件总经理，博世汽车电子中国区总裁Georges Andary--GM of Bosch Automotive Products (Suzhou) Co., Ltd., Regional President of Bosch Automotive Electronics China

极智报告|西安特锐德智能充电科技有限公司总工程师王利强 ：电动汽车充电技术发展及SiC应用。更多专业学术报告，请点击页面顶端下载极智头条APP，海量报告，免费看！

美国国家工程院院士、美国加利福尼亚大学杰出教授、Transphorm 的联合创始人Umesh K. MISHRA的高足吴毅锋博士，分享了功率器件之争：宽禁带vs硅的发展动态。 吴毅锋表示宽禁带技术对于电力、能源节约具有非常重要的意义。我们需要继续发展功率元件，该领域的市场潜力非常大，对于功率器件而言，可靠性至关重要。结合目前的发展情况，对于硅、碳化硅和硅基氮化镓来说，硅基氮化镓能力性可能更强。硅是目前功率元件中最成功的，已经