GaAs VCSEL 先进封装技术进展及应用Progress of Advanced Packaging Techniques for GaAs-based VCSELs and Its Applications林胜宁波升谱光电股份有限公司副总经理LIN ShengDeputy General Manager of NINGBO SUNPU LED CO.,LTD.

先进封装大板扇出研发及功率器件封装应用The Research on Panel Level Fan Out Package and its Application on Power Electronics林挺宇广东佛智芯微电子技术研究有限公司副总经理，广东省半导体智能装备与系统集成创新中心首席科学家Tingyu LINDeputy General Manager of Guangdong FZX Microelectronics Technology Co. Ltd, Principal Scientist of CNC Equipment Cooperative Innovation Institute