2024年11月18-21日，第十届国际第三代半导体论坛（IFWS2024）&第二十一届中国国际半导体照明论坛（SSLCHINA2024）、先进半导体技术应用创新展（CASTAS）将在苏州国际博览中心举办。
元旭半导体科技股份有限公司（简称"元旭半导体"）将携多款Micro-LED芯片、COB显示产品亮相此次展会。值此，诚挚邀请第三代半导体产业同仁共聚论坛，莅临A04号展位参观交流、洽谈合作。
同时，元旭半导体科技股份有限公司董事会主席兼首席执行官（CEO）席光义将出席论坛，并将在“Mini/Micro-LED技术产业应用峰会”上，分享《从芯到屏，垂直整合 开启Micro-LED智慧显示时代》的主题报告。敬请关注！
报告嘉宾
席光义
元旭半导体科技股份有限公司董事会主席兼首席执行官（CEO）
席光义博士（清华大学电子工程系），是我国最早从事GaN基LED、HEMT材料与器件的科研人员之一，师从中国工程院院士、半导体光电子技术专家罗毅院士。作为元旭半导体科技股份有限公司董事会主席兼首席执行官（CEO），席光义博士带领科研队伍始终聚焦于Micro LED显示芯片产业布局，并建立了具有自主知识产权的“IDM 2.0”创新模式技术体系，解决了我国大尺寸高光效图形化蓝宝石衬底严重依赖进口的问题。自2003年起，席光义博士开始从事半导体产业的研发工作，曾参与国家重大科技专项，并发表了十余篇论文。2014年，他与团队共同创立了元旭半导体科技股份有限公司，成功实现了Micro LED显示芯片、新型视觉技术等关键技术的布局，并积极推动Micro LED新一代半导体显示技术的产业升级。
演讲报告：《从芯到屏，垂直整合 开启Micro-LED智慧显示时代》
演讲会场：Mini/Micro-LED技术产业应用峰会
关于元旭半导体Company Profile
元旭半导体科技股份有限公司创立于2014年，致力于Micro-LED芯片技术和新一代智慧显示产品的研发与产业化创新。 作为Micro-LED显示行业的技术型领军企业，元旭半导体以自研Micro-LED显示芯片和先进集成封装技术作为强支撑，聚焦于新一代智慧显示产品的设计与创新，形成从Micro-LED显示芯片、先进集成封装到新一代智慧显示产品的垂直整合智造，创新性地打造了“IDM 2.0”创新模式体系，涵盖设计、研发、生产、销售于一体，实现“从芯到屏”的一站式产业化布局，在成本控制和产品性能特征方面实现跨越式地提升。
INNOSHINE Technology Co., Ltd.（“INNOSHINE”）was established in 2014 and is dedicated to the research and industrialization of Micro-LED chip technology and next-generation smart display products.
As a technology-driven pioneer in the Micro-LED display industry, Yuanxu Semiconductor relies on its self-developed Micro-LED display chip and advanced integrated packaging technology as strong support, focusing on the design and innovation of next-generation smart display products. It has formed a vertically integrated smart manufacturing system from Micro-LED display chips, advanced integrated packaging to next-generation smart display products, and has innovatively created a "IDM 2.0" innovation model system, covering design, R&D, production, and sales, to achieve a one-stop industrial layout from "core to screen" and achieve a breakthrough in cost control and product performance characteristics. For further information on INNOSHINE, please visit our website at: www.novoshine.com.
产品介绍/about Products
（一）晶圆衬底 Wafer substrate
（1）蓝宝石基材料晶圆衬底——元旭半导体在蓝宝石衬底材料方面实现多个全国首创。2014年，首创完成湿法晶圆衬底，带领公司率先实现国产化；2018年，元旭半导体首创完成六英寸纳米晶圆衬底，并实现大规模量产，着力破解半导体领域“卡脖子”难题。
（2）硅基材料晶圆衬底——作为实现Micro-LED集成应用的关键材料技术，元旭半导体开发出8英寸、12英寸硅基GaN外延，为实现晶圆级集成电路打下坚实基础。
(1) Sapphire substrate material wafers - INNOSHINE has achieved several national firsts in sapphire substrate material. In 2014, it pioneered the wet process wafer substrate, leading the company to become the first to achieve domestication. In 2018, INNOSHINE pioneered the production of 6-inch nanocrystalline wafer substrate and achieved mass production, focusing on breaking the "neck-tie" problem in the semiconductor field.
(2) Silicon-based material wafer substrate - As a key material technology for realizing Micro-LED integrated applications, INNOSHINE has developed 8-inch and 12-inch silicon-based GaN epitaxy, laying a solid foundation for wafer-level integrated circuits.
（二）Micro-LED芯片 Micro-LED chip
元旭半导体自研全新Micro-LED芯片，重新定义Micro-LED芯片结构及IDM 2.0集成工艺架构，将LED行业分离器件跨入到Micro-LED集成芯片时代。在Micro-LED技术的研发上，不仅突破了芯片设计、微型化薄膜芯片、巨量转移、超高精度布线等关键技术，更实现了超高清像素直显、低功耗超节能、高亮度、宽色域、高对比度、宽视角、高动态特性、高可靠性等优异显示性能，并通过优化芯片排布方式、无引线电连接、封装结构和表面处理工艺，进一步提高产品可靠性，为Micro-LED新型显示技术的革新提供强有力支撑。
INNOSHINE has developed a brand new Micro-LED chip, redefining the Micro-LED chip structure and IDM 2.0 integrated process architecture, bringing the LED industry from a separable device era to the Micro-LED integrated chip era. In the research and development of Micro-LED technology, not only has INNOSHINE broken through key technologies such as chip design, miniaturization of thin film chips, mass transfer, ultra-high precision wiring, but it has also achieved excellent display performance such as ultra-high resolution pixel direct display, low power consumption and ultra-energy saving, high brightness, wide color gamut, high contrast ratio, wide viewing angle, and high dynamic characteristics, as well as high reliability. Furthermore, by optimizing the chip layout, wirelessly connecting the chips, and improving the packaging structure and surface treatment process, INNOSHINE has further enhanced the reliability of its products, providing strong support for the innovation of Micro-LED new display technology.
（三）全倒装COB LED显示屏 Full-flip COB LED Display
在“自主性研发＋智能化制造自主化生产”双重核心能力的驱动下，元旭半导体依托天津、无锡集成光电子整合智造工厂，原厂生产并成体系推出“Xmeta”、“光璨”、“LEG GO”三大系列产品，产品分别定位于专业显示、商业显示与场景化解决方案显示，真正实现从芯片设计到封测的高度自主可控。
元旭半导体COB显示产品全面搭载级半导体级生产工艺，并在超精密生产环境（百级洁净空间）中进行制造，显著降低生产过程中异物对Micro-LED产品良品率和质量稳定性的影响。COB显示产品特有的高亮度、高对比度、高分辨力、低电压驱动、低功耗、低屏温、长寿命等突出特点，为指挥控制中心、大数据中心、智慧城市、数字孪生、工业仿真、文旅文化产业等对画质有较高要求的应用环境而进行高端化定制。元旭半导体积极推动Micro-LED技术发展，使其逐步拓展ToB及ToC市场。
Driven by the dual core capabilities of independent R&D and intelligent manufacturing and production, INNOSHINE has relied on its integrated optoelectronics integration and manufacturing factories in Tianjin and Wuxi to produce and systematically launch the "Xmeta", "G", and "LEG GO" product series. The products are respectively positioned in professional display, commercial display, and scene-based solution display, and truly achieve full control over the chip design and packaging and testing from a height of autonomy.
INNOSHINE's COB display products are fully equipped with semiconductor-level production processes and manufactured in ultra-precise production environments (class 100 clean space), significantly reducing the impact of foreign objects on the Micro-LED product yield and stability. The COB display products have distinctive features such as high brightness, high contrast ratio, high resolution, low voltage driving, low power consumption, low screen temperature, and long life, which are specially tailored for high-end customization for application environments with high requirements for image quality, such as command and control centers, big data centers, smart cities, digital twins, industrial simulation, and cultural and tourism industries. INNOSHINE actively promotes the development of Micro-LED technology to gradually expand its market to both B and C segments.
参会联系：
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