面向Micro-LED封装的先进半导体键合集成技术
Advanced Semiconductor Bonding Technology for Micro-LED Integration
母凤文——北京青禾晶元半导体科技有限责任公司董事长兼总经理
MU Fengwen——President and General Manager of Innovative Semiconductor Substrate Technology co., Ltd.
面向Micro-LED封装的先进半导体键合集成技术
Advanced Semiconductor Bonding Technology for Micro-LED Integration
母凤文——北京青禾晶元半导体科技有限责任公司董事长兼总经理
MU Fengwen——President and General Manager of Innovative Semiconductor Substrate Technology co., Ltd.