先进封装大板扇出研发及功率器件封装应用

The Research on Panel Level Fan Out Package and its Application on Power Electronics 

林挺宇——广东佛智芯微电子技术研究有限公司副总经理，广东省半导体智能装备与系统集成创新中心首席科学家

Tingyu LIN—Deputy General Manager of Guangdong FZX Microelectronics Technology Co. Ltd, Principal Scientist of CNC Equipment Cooperative Innovation Institute